1 radiation hardened 3.3v quad differential line receiver hs-26clv32rh, hs-26clv32eh the intersil hs-26clv32rh, hs-26clv32eh are radiation hardened 3.3v quad differential line receiver designed for digital data transmission over ba lanced lines, in low voltage, rs-422 protocol applications . radiation hardened cmos processing assures low power consumption, high speed, and reliable operation in the most severe radiation environments. the hs-26clv32rh, hs-26clv32eh have an input sensitivity of 200mv (typ) over a common mode input voltage range of -4v to + 7v. the receivers are also equipped with input fail safe circuitry, which causes the outputs to go to a logic ?1? when the inputs are open. the device has unique inputs that remain high impedance when the receiver is disabled or powered-down, maintaining signal integrity in multi-receiver applications. specifications for rad hard qml devices are controlled by the defense logistics agency land and maritime (dla). the smd numbers listed here must be used when ordering. detailed electrical specifications for these devices are contained in smd 5962-95689 . a ?hot-link? is provided on our homepage for downloading. features ? electrically screened to smd # 5962-95689 ? qml qualified per mil-prf-38535 requirements ? 1.2 micron radiation hardened cmos - total dose . . . . . . . . . . . . . . . . . . . . . . . . . 300 krad(si)(max) - single event upset let . . . . . . . . . . . . . 100mev/mg/cm 2 ) - single event latch-up immune ? low stand-by current . . . . . . . . . . . . . . . . . . . . . . . 13ma(max) ? operating supply range . . . . . . . . . . . . . . . . . . . . . 3.0v to 3.6v ? enable input levels. . . . . . . .v ih > (0.7)(v dd ); v il < (0.3)(v dd ) ? cmos output levels . . . . . . . . . . . . . .v oh > 2.55v; v ol < 0.4v ? input fail safe circuitry ? high impedance inputs when disabled or powered-down ? full -55c to +125c military temperature range ? pb-free (rohs compliant) applications ? line receiver for mil-std-1553 serial data bus ordering information part number (note) internal mkt. number part marking temp. range (c) package (pb-free) pkg. dwg. # 5962f9568902qec hs1-26clv32rh-8 q 5962f95 68902q ec -55 to +125 16 ld sbdip d16.3 5962f9568902qxc hs9-26clv32rh-8 q 5962f95 68902qxc -55 to +125 16 ld flatpack k16.a 5962f9568902vec hs1-26clv32rh-q q 5962f95 68902vec -55 to +125 16 ld sbdip d16.3 5962f9568902vxc hs9-26clv32rh-q q 5962f95 68902vxc -55 to +125 16 ld flatpack k16.a 5962F9666302V9A hs0-26clv31rh-q -55 to +125 die hs0-26clv31rh/sample hs0-26clv31rh/sample -55 to +125 die hs1-26clv32rh/proto hs1-26clv32rh/proto hs1- 26clv32rh /proto -55 to +125 16 ld sbdip d16.3 hs9-26clv32rh/proto hs9-26clv32rh/proto hs9- 26clv32rh /proto -55 to +125 16 ld flatpack k16.a 5962f9568904vec hs1-26clv32eh-q q 5962f95 68904vec -55 to +125 16 ld sbdip d16.3 5962f9568904vxc hs9-26clv32eh-q q 5962f95 68904vxc -55 to +125 16 ld flatpack k16.a 5962f9568904v9a hs0-26clv32eh-q -55 to +125 die note: these intersil pb-free hermetic packaged products employ 100% au plate - e4 termination finish, which is rohs compliant and compatible with both snpb and pb-free soldering operations. january 8, 2013 fn4907.4 caution: these devices are sensitive to electrostatic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | copyright intersil americas inc. 2000, 2008, 2009, 2012, 2013. all rights reserved intersil (and design) is a trademark owned by intersil corporation or one of its subsidiaries. all other trademarks mentioned are the property of their respective owners.
hs-26clv32rh, hs-26clv32eh 2 fn4907.4 january 8, 2013 logic diagram enable enable aout bout cout din dout din cin cin bin bin ain ain +- +- +- +- pin configurations hs1-26clv32rh, hs1-26clv32eh (16 ld sbdip) mil-std-1835: cdip2-t16 top view hs9-26clv32rh, hs9-26clv32eh (16 ld flatpack) mil-std-1835: cdfp4-f16 top view notes: 1. for details on input output structures refer to application note an9520. 2. for details on package dimensions refer mil std 1835. 14 15 16 9 13 12 11 10 1 2 3 4 5 7 6 8 ain ain aout enable cout cin gnd cin v dd bin bout enable dout din din bin ain ain aout enable cout cin cin gnd 2 3 4 5 6 7 8 116 15 14 13 12 11 10 9 v dd bin bin bout enable dout din din
hs-26clv32rh, hs-26clv32eh 3 intersil products are manufactured, assembled and tested utilizing iso9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality intersil products are sold by description only. intersil corporat ion reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnished by intersil is believed to be accurate and reliable. however, no responsi bility is assumed by intersil or its subsid iaries for its use; nor for any infringem ents of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of i ntersil or its subsidiaries. for information regarding intersil corporation and its products, see www.intersil.com fn4907.4 january 8, 2013 for additional products, see www.intersil.com/product_tree die characteristics die dimensions: 78 mils x 123 mils x 21 mils (1970m x 3120m) interface materials: glassivation: type: psg (phosphorus silicon glass) thickness: 8k ? 1k ? substrate: avlsi1ra, silicon backside, v dd backside potential metallization: bottom: mo/tiw thickness: 5800 ? 1k ? top: al/si/cu thickness: 10k ? 1k ? worst case current density: <2.0 x 10 5 a/cm 2 bond pad size: 110m x 100m metallization mask layout hs-26clv32rh, hs-26clv32eh ain v dd bin ain (2) a out (3) enab (4) c out (5) c in (6) (8) (9) (14) b in (13) b out (12) enab (11) d out (10) d in (1) (16) (15) (7) cin gnd din table 1. hs-26clv32rh, hs-26clv32eh pad coordinates pin number pad name relative to pin 1 x coordinates y coordinates 1ain 00 2 ain -337.1 -362 3a out -337.1 -912.5 4 enable -337.1 -1319.3 5c out -337.1 -1774.4 6 cin -337.1 -2233.7 7cin 0 -2595.7 8 gnd 418.4 -2596.7 9din 776.4 -2595.7 10 din 1113.5 -2233.7 11 d out 1113.5 -1774.4 12 enable 1113.5 -1319.3 13 b out 1113.5 -898.4 14 bin 1113.5 -362 15 bin 776.4 0 16 vdd 420.2 1 note: dimensions in microns
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